![]() New Bidirectional Interface for Inventor and Parametric Sweeps Parasolid support saves substantial time when meshing by enabling you to mesh on the Parasolid geometry directly. It enhances productivity by giving you the ability to repair or defeature individual parts in an assembly easily and quickly. Parasolid improves file import efficiency by eliminating the conversion of objects to COMSOL geometry. Additionally, the CAD Import Module is now also available on the Macintosh. Interoperability with third-party engineering and scientific applications is greatly enhanced in version 3.5 by supporting the Parasolid file format from Siemens PLM Software throughout the CAD import process. Optimized code has boosted shared-memory parallelism speedup by 20%. Larger problems can be run using the new out-of-core solver, which utilizes disk memory for efficiently storing intermediate results on 32-bit and 64-bit computers. Two to eight times faster time-domain wave simulations and fluid flow simulations are now achieved through solver enhancements. The temperature distribution color plot on both the board and heat sink illustrate the effectiveness of the cooling fins. ![]() This COMSOL Heat Transfer Module image shows a simulation of a PC board where a disk stack heat sink prevents overheating of a power IC. This solver also offers new flexible settings that make setting up problems with various multiphysics couplings easier and faster. You can also cut memory usage by as much as 50 percent for common dynamic multiphysics simulations, such as Joule heating, with the new time-dependent segregated solver. Solving is substantially faster for time-dependent structural mechanics, electromagnetic, acoustics, and fluid-flow simulations using a new solver. Benchmark tests show that version 3.5 is more than 3 times faster for large flow models when compared to version 3.4. Raised efficiency, increased performance, and reduced memory requirements throughout COMSOL Multiphysics 3.5 is achieved by the implementation of new solvers and revised implementation of the existing ones. The isosurface plot shows the sound pressure level, while the boundary color plot is the pressure. This model simulates the application of a nominal driving voltage to extract sound pressure level as a function of the frequency. Using COMSOL Acoustics Module 3.5, you can simulate how a loudspeaker’s enclosure and placement affect sound in a room.
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